1‌. Industry background: What is PCD Disk?

Polycrystalline Diamond (PCD) is a superhard composite material madeby sintering diamond micro powder and hard alloy substrate under hightemperature and high pressure (HPHT) environment. It possesses both theextremely high hardness and wear resistance of diamond, as well as thestrength, toughness, and weldability of hard alloy.

At present, PCD has become the core material for manufacturingprecision machining tools, petroleum and mining drill bits, and wear-resistantcomponents. However, the Mohs hardness of up to level 10 also makes subsequentprocessing a recognized challenge in the industry. 

2. Limitations of traditionalprocessing methods

In the field of precision manufacturing, commonly used PCD cuttingmethods mainly include:

• Wire EDM (WEDM): Although it can process conductive materials, itsefficiency is limited, and it is prone to leaving rough surfaces and heataffected zones as deep as several wires at the edges.
• Traditional grinding: high consumable costs, extremely slowprocessing speeds, and difficulty in handling complex geometric shapes.
•  Pain points: Traditional processes can easily lead to carbonizationof diamond layers, edge chipping, or thermal warping deformation of materialsdue to excessive heat input, seriously affecting the quality of brazing.

3. TKD-300F: Advanced Solutionfor Cutting Superhard Materials

TKD CO., LTD has developed the TKD-300Flaser cutting machine to address the pain points in the aforementionedindustries. This device adopts precision laser ablation technology, achievingthe unity of high efficiency and high precision.

The core technological advantages of TKD-300F:

1)       Excellent cross-sectionalquality: The cutting surface is vertical and flat, and after sandblasting, itpresents a white and shiny metallic luster. This clean surface without oxidelayer obstruction greatly improves the wettability and bonding strength duringbrazing.

2)       Micron level precision control:Excellent edge integrity, no collapse observed at 10x magnification (collapseamount<0.005mm). The heat affected zone (HAZ) is precisely controlled within5 wires (0.05 mm), completely eliminating the phenomenon of diamondcarbonization.

3)       Full thickness processingconsistency: Whether it is a conventional sheet of 4.0 mm or a thick sheet of10 mm, TKD-300F can maintain consistent upper and lower surface dimensions, andwill not cause tool grain warping deformation due to heat input.

4)       Simultaneous ablation ofheterogeneous materials: The laser has excellent matching speed for theablation of diamond layers and hard alloy substrates, ensuring a smoothtransition at the interface of the composite layer.

4. Conclusion

TKD-300F is not only a cutting equipment,but also a powerful tool for precision tool manufacturing enterprises toimprove efficiency. It solves the technical difficulties of the entire processfrom material melting to subsequent brazing by precise control of laser thermalinput, setting a new benchmark for superhard material processing.

====================================FAQ=========================================

Q1: Why is the traditional wire cutting(WEDM) method not ideal for processing diamond composite (PCD)?

A: Although traditional wire cutting canprocess conductive materials, its efficiency is low and it is prone togenerating deep heat affected zones (HAZ). This can lead to diamondcarbonization or microcracks at the edges of PCD. In addition, the rough surfaceand oxide layer left by wire cutting will seriously weaken the wettability ofsubsequent brazing, resulting in the tool head falling off during high-speedcutting. The TKD-300F adopts laser ablation technology, which avoids theseproblems from the source.

Q2: What level of edge accuracy canTKD-300F achieve after laser cutting?

A: Our equipment has reached the industrybenchmark in precision control. Under a 10x magnifying glass, there is almostno visible edge collapse at the cutting edge, and the amount of edge collapseis strictly controlled within 0.005mm (5 μ m). Thisalmost perfect edge integrity greatly reduces subsequent grinding processes,saving businesses a lot of processing time and costs.

Q3: What impact does the heat affectedzone (HAZ) have on PCD cutting tools? How to control TKD?

A: An excessively large heat affected zonecan cause the diamond layer to undergo "graphitization" (i.e.carbonization), resulting in the superhard material losing its expected wearresistance. The TKD-300F compresses the heat affected zone within 0.05mm (5wires) by precisely controlling the laser pulse energy, ensuring that theoriginal physical properties of PCD are not damaged and extending the servicelife of the tool.

Q4: How to ensure no deformation whencutting thin composite sheets (such as 10mm)?

A: The difficulty in processing ultra-thindiamond composite sheets lies in the "thermal warping" caused bythermal accumulation. TKD-300F has an optimized laser thermal input algorithm,which ensures consistent surface size even for ultra-thin PCD chips with athickness of 10mm. Its precise cold working characteristics effectivelysuppress thermal stress, ensuring that the material maintains excellentflatness even after cutting.

Q5: Why does the cut surface need topresent a "bright white luster"? What is the practical significanceof this?

A: The cutting surface presents a white andshiny metallic luster, indicating that there are no residual oxide layers orcarbide impurities on the surface. This is crucial for the brazing process. Aclean surface can significantly improve the wettability of the brazingmaterial, making the diamond composite more firmly bonded to the substrate,ensuring the stability and safety of the tool in high load cuttingenvironments.