Lasertechnology has been widely used in the superhard material processing industry,especially in the cutting, drilling and chamfering of PCD (polycrystallinediamond) drawing dies, PCD blanks, CVD diamonds, CBN composites, ceramics andsilicon materials. Our laser cutting equipment provides excellent processingsolutions through efficient laser technology.
ProductFeatures
1.High cutting efficiency:
Thisequipment shows excellent cutting effect when cutting superhard materials, andcan quickly and accurately complete various complex cutting tasks, greatlyimproving production efficiency.
2.No consumables required:
Except for the optical protection sheet, thisequipment does not require other consumable materials, which greatly reducesoperating costs. Users can reduce material consumption while maintaining highefficiency.
3.Green and environmentally friendly:
Theoperating power is only 1.2-2.5Kw/h, and the energy consumption generated bythe equipment during use is relatively low, which is in line with the moderngreen and environmentally friendly production concept and helps the sustainabledevelopment of enterprises.
4.Stable operation and user-friendly design:
Thisequipment adopts an advanced control system and has stable user-friendlyoperation characteristics, making the use of the equipment easy to understandand reducing the learning curve of operators.
5.Zero maintenance:
Thedesign fully considers the need for zero maintenance. The equipment does notrequire frequent maintenance during operation, and users can focus onproduction and improve work efficiency.
Wideapplication
Thislaser cutting equipment is widely used in many fields, including but notlimited to:
1.Manufacturing: used for precision processing of various superhard materials toimprove product quality.
2.Electronics industry: Detailed processing of silicon materials and ceramics toensure product performance.
3.Mold making: Meet the needs of the mold industry with efficient andhigh-precision processing capabilities.
Main Parameters | TKD-150F | TKD-300F |
Rated power | 1000W | 1500W |
Repeat frequency | 1~3000Hz | |
Pulse width | 0.05~20ms | |
1.6 mm PCD cutting speed | ≥110mm/min | ≥150mm/min |
2.0mm PCD cutting speed | ≥70mm/min | ≥120mm/min |
heat influence range | ≤0.05 mm | |
Kerf width | ≤0.1 mm | |
heat influence range | ≤0.05 mm | |
Max thickness of single side pass | 3mm | 5mm |
Max thickness of double-sided pass | 4mm | 9mm |
Table Travel | 300mm*300mm |